SRI’s Integrated Systems & Solutions Division (InSyS) designs leading-edge R&D technologies that power the systems end users depend on every day. From proof-of-concept to execution in the real world, we provide our customers with the keys to achieve their objectives. Our goal: To uncover and deliver on profound possibilities for a smarter, safer, and more sustainable world.

InSyS’s Center for Advanced Imaging (CAI) is pioneering next-generation technologies that are changing the way we see and understand our world across the electro-optical spectrum. CAI is searching for a Mechanical Designer/Engineer (ME) (level I or II) to join their team. The ME will join a multidisciplinary group dedicated to the development of custom image sensor devices, modules, and systems for numerous commercial, spacecraft, and government applications.

The position will work onsite in our Princeton, NJ office.

• Design mechanical parts, and assemblies using SolidWorks.
• Verify designs using SolidWorks Simulation and SolidWorks Simulation Professional.
• Generate part, assembly and ICD.
• Create product structures using OMNIFY PLM, generate ECO and formal release of parts and assemblies.
• Interact with SME, Electrical engineering and program management.
• Support proposal efforts, program reviews and status meetings.
• Generate photo quality renderings and provide information pertinent to the design based on the CAD model.
• Interface with internal and external fabrication and manufacturing facilities.
• Must be willing to work “Hands On” in cleanroom and in lab product and R&D atmosphere

• BS or equivalent experience in the field of Mechanical/Aerospace Engineering, Mechanical/Aerospace Design, or related scientific discipline.
  • Mechanical Engineer I: 0-3 years experience
  • Mechanical Engineer II: 3-5 years experience
• Due to government requirements candidates must be a US Citizen
• Proficient with SolidWorks Professional and Simulation Professional including Thermal, Thermal Stress, Flow, Altium Co Designer, Circuit Works and Electronics Cooling Module add in.
• Solid understanding of compact electronic packaging techniques, Thermal and mechanical packaging designs.
• Design for manufacturing.
• Fixture design for production manufacturing assemblies.
• Ability to work with precision assemblies that may include cleanroom activities, epoxies, microscopes, CMM inspection.
• Model Shop/Machine Shop ‘hands on” experience (CNC, lathe, welding etc.) a plus
• Heat pipe and TEC design simulation a plus
• Experience with die level packaging, imager packaging, ceramic packaging and die on board design a plus.

The salary range is ME I: $63,873-$84,636  ME II: $81,522-$108,018. Salary ranges will vary and are based on several factors, including geographic location, market competitiveness and equity amongst internal employees in similar roles. Positions may also qualify for SRI's Pay for Outstanding Performance program or the annual Performance Based Compensation program. SRI also has a competitive benefits package, to view details please go to https://www.sri.com/resources/benefits/. SRI will accept applications until the position is filled.

SRI is an independent nonprofit research institute headquartered in Menlo Park, Calif., with a rich history of supporting government and industry. We create and deliver world-changing solutions for a safer, healthier, and more sustainable future. For almost 80 years, we have collaborated across technical and scientific disciplines to discover and develop groundbreaking products and technologies and bring innovations and ideas to the marketplace.